Biography
Dr. Jeff Punch is the Assistant Dean for Research for the Faculty of Science and Engineering at the University of Limerick. He is also a faculty member within the School of Engineering. In terms of research, he directs the Stokes Laboratories at ULs Bernal Institute a research group dedicated to education and innovation in mechanical engineering science and he is a Funded Investigator of the SFI-funded CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems with emphasis on thermal / energy management and reliability physics. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.
Research Interests
The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems with particular emphasis on thermal / energy management and reliability physics.
Professional Activities
Committee
- 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
- 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
- 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
- 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
- 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
- 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
- 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
- 2005 American Society of Mechanical Engineers InterPack Conference 2005,
- 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
- 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
- 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
- 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
- 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
- EU FP7 ERC Starting Independent Investigator Grants,
Patent
- 2003 US 6,671,755 - System for Data Capture from a Rotor
- 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
- 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
- 2001 IE 20000403 - A Data Capture System
- 2000 EP 1058092 - A Data Capture System
- 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
- 1999 IE 06/000129 - A Cooling Device
Employment
- 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
- 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
- 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow
Association
- 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods
- 1999 Chartered Engineer, Member Engineers Ireland
- 1999 Member, American Society of Mechanical Engineers
Education
- 1994 University of Limerick - Ph.D.
- 1990 University of Limerick - Bachelor of Engineering
Award
- 1990 - PEI Technologies Postgraduate Scholarship
Consultancy
- - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)
- - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)
Language
- English
- German
Publications
Book Chapter
Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards
Punch, J; Davies, MRD
Thermal Management of Electronic Systems III
A Parametric Study of Heat Spreading Through Multiple Layer Substrates
PUNCH, J; DAVIES, M
Thermal Management of Electronic Systems
The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count
Davies, MRD; Punch, J; Moore, T; Lohan, J
Thermal Management of Electronics Systems
A Parametric Study of Heat Spreading Through Multiple Layer Substrates
Punch, J; Davies, MRD
Thermal Management of Electronic Systems
Conference Contribution
Conference Publication
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Breen T.J., Walsh E.J., Punch J., Shah A.J., Bash C.E.
DOI: 10.1109/ITHERM.2010.5501421
IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1
Herkommer, D; Punch, J; Reid, M
DOI: 10.1115/InterPACK2009-89105
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS
Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE
DOI: 10.1109/ITHERM.2010.5501421
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE
DOI: 10.1109/ITHERM.2010.5501422
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Walsh E.J., Breen T.J., Punch J., Shah A.J., Bash C.E.
DOI: 10.1109/ITHERM.2010.5501422
EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
Herkommer, D; Reid, M; Punch, J
HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1
Jeffers, N; Punch, J; Walsh, E
IEEE Electronic Components and Technology Conference
Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I.
DOI: 10.1109/ECTC.2009.5074048
HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
Jeffers, N; Punch, J; Walsh, E
Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Kelly G., Punch J., Goyal S., Sheehy M.
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3
Herkommer, D; Reid, M; Punch, J
Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Sheehy M., Lishchynska M., Punch J., Goyal S., Kelly G.
DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS
Sheehy, M; Reid, M; Punch, J; Goyal, S; Kelly, G
Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
Sheehy M., Kelly G., Rodgers B., Punch J., Goyal S.
PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
Jeffers, N; Punch, J; Walsh, E
Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
Kelly G., Sheehy M., Rodgers B., Punch J., Goyal S.
Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems
Sheehy M., Punch J., Rodgers B., Goyal S.
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Kelly G.A., Punch J.M., Goyal S.
2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL
Reid, M; Punch, J; Rodgers, B; Pomeroy, MJ; Galkin, T; Stenberg, T; Rusanen, O; Elonenc, E; Vilen, M; Vakevainen, K
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Rodgers, B; Flood, B; Punch, J; Waldron, F
Advances in Electronic Packaging 2005, Pts A-C
Reid, M; Punch, J; Rodgers, B; Galkin, T; Stenberg, T; Rusanenc, O; Elonen, E; Vilen, M; Vakevainen, K
Advances in Electronic Packaging 2005, Pts A-C
Rodgers, B; Flood, B; Punch, J; Waldron, F
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Reid, M; Punch, J; Galkin, T; Vakevainen, K; Stenberg, T; Vilen, M; Pomeroy, MJ; Mihov, M
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Ryan C., Rodgers B., Punch J.M., Heaslip G., Murphy E., O'Neill S.
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Heaslip G.M., Punch J.M., Rodgers B.A., Ryan C.
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Rodgers B., Ryan C., Punch J., Waldron F., Floyd L.
American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Punch J., Rodgers B., Newport D., Davies M.
American Society Of Mechanical Engineers, Heat Transfer Division, (Publication) Htd
Proceedings of the Annual Reliability and Maintainability Symposium
Donovan J., Loll V., Punch J.
ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS
Rodgers, B; Punch, J; Jarvis, J; Myllykoski, P; Reinikainen, T
Proceedings of the National Heat Transfer Conference
Davies M., Cole R., Punch J.
Proceedings of the National Heat Transfer Conference
Cole R., Davies M., Punch J.
THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS
DAVIES, M; LOHAN, J; PUNCH, J; MOORE, T
Other Journal
Other Publication
Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator
Jeffers, N; Punch, J; Walsh, E
DOI: 10.1007/s12650-010-0033-2
Industrial seminars on the Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, L; Dalton, T; Newport, D
Lecture Series on Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, J
Lecture Series on Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Dillon, P
The Computer Products Guide to the Thermal Management of Power Converters
Punch, J; Davies, MRD
Cool Power
Davies, MRD; Rodgers, P; Punch, J
Cooling Electronic Power Supplies
Davies, MRD; Rodgers, P; Punch, J
Peer Reviewed Journal
Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
Herkommer, D,Punch, J,Reid, M
Ieee Transactions On Components Packaging And Manufacturing Technology
DOI: 10.1109/TCPMT.2012.2227481
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Rubenstein, B,Heath, S,Kumari, N
Journal Of Electronic Packaging
DOI: 10.1115/1.4007110
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Kumari, N,Cader, T
Journal Of Electronic Packaging
DOI: 10.1115/1.4007744
Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors
Collins, M.N., Punch, J. and Coyle, R.,
Soldering & Surface Mount Technology
Surface finish effect on reliability of SAC 305 soldered chip resistors
Collins, MN,Punch, J,Coyle, R
Soldering & Surface Mount Technology
DOI: 10.1108/09540911211262520
From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE
Journal Of Electronic Packaging
DOI: 10.1115/1.4004657
Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
Collins, MN; Punch, J; Coyle, R; Reid, M; Popowich, R; Read, P; Fleming, D
Ieee Transactions On Components Packaging And Manufacturing Technology
DOI: 10.1109/TCPMT.2011.2150223
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE
Journal Of Electronic Packaging
DOI: 10.1115/1.4003274
Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S
Ieee Transactions On Components Packaging And Manufacturing Technology
DOI: 10.1109/TCPMT.2011.2140109
Corrosion of Cu under Highly Corrosive Environments
Demirkan, K; Derkits, GE; Fleming, DA; Franey, JP; Hannigan, K; Opila, RL; Punch, J; Reents, WD; Reid, M; Wright, B; Xu, C
Journal Of The Electrochemical Society
DOI: 10.1149/1.3258288
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
Herkommer, D; Punch, J; Reid, M
Microelectronics Reliability
DOI: 10.1016/j.microrel.2009.08.008
Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets
Jeffers N.M.R., Punch J., Walsh E.J., Mclean M.
Journal Of Thermal Science And Engineering Applications
DOI: 10.1115/1.4003220
Shock pulse shaping in a small-form factor velocity amplifier
Kelly, G; Punch, J; Goyal, S; Sheehy, M
Shock And Vibration
DOI: 10.3233/SAV-2010-0521
Energy Scavenging for Energy Efficiency in Networks and Applications
Kim, KJ; Cottone, F; Goyal, S; Punch, J
Bell Labs Technical Journal
DOI: 10.1002/bltj.20438
The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli
Sheehy, M; Punch, J; Goyal, S; Reid, M; Lishchynska, M; Kelly, G
Strain
DOI: 10.1111/j.1475-1305.2008.00610.x
In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Reid, M; Punch, J
Journal Of Electronic Materials
DOI: 10.1007/s11664-009-0885-1
An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps
Kearney, D; Punch, J; Grimes, R
Asme Journal Of Fluids Engineering
Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Punch, J; Reid, M
Ieee Transactions And Packaging Technologies
A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples
Herkommer, D; Reid, M; Punch, J
Ieee Transactions On Components And Packaging Technologies
DOI: 10.1109/TCAPT.2009.2014071
Friction factor and heat transfer in multiple microchannels with uniform flow distribution
Park, HS; Punch, J
International Journal Of Heat And Mass Transfer
DOI: 10.1016/j.ijheatmasstransfer.2008.02.009
Piecewise analysis and modeling of circuit pack temperature cycling data
Joyce, T. and Lisay Jr, E.J. and Dalton, D.E. and Punch, J.M. and Shellmer, M.S. and Kher, S.N. and Goyal, S.
Bell Labs Technical Journal
Corrosion resistance of copper-coated contacts
Reid, M; Punch, J; Grace, G; Garfias, LF; Belochapkine, S
Journal Of The Electrochemical Society
DOI: 10.1149/1.2352042
A board level study of an array of ball grid components
Cole, R; Davies, M; Punch, J
Journal Of Electronic Packaging
DOI: 10.1115/1.1604811
Electronics Cooling
Punch, J
The Irish Scientist
Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.
Punch, J; Davies, MRD
American Society Of Mechanical Engineers