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Dr. Jeff Punch

Biography

Dr. Jeff Punch is the Assistant Dean for Research for the Faculty of Science and Engineering at the University of Limerick. He is also a faculty member within the School of Engineering. In terms of research, he directs the Stokes Laboratories at UL's Bernal Institute – a research group dedicated to education and innovation in mechanical engineering science – and he is a Funded Investigator of the SFI-funded CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems – with emphasis on thermal / energy management and reliability physics. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.

Research Interests

The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems – with particular emphasis on thermal / energy management and reliability physics.

Professional Activities

Committee

  • 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
  • 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
  • 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
  • 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
  • 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
  • 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
  • 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
  • 2005 American Society of Mechanical Engineers InterPack Conference 2005,
  • 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
  • 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
  • 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
  • 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
  • 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
  • EU FP7 ERC Starting Independent Investigator Grants,

Patent

  • 2003 US 6,671,755 - System for Data Capture from a Rotor
  • 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
  • 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
  • 2001 IE 20000403 - A Data Capture System
  • 2000 EP 1058092 - A Data Capture System
  • 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
  • 1999 IE 06/000129 - A Cooling Device

Employment

  • 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
  • 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
  • 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow

Association

  • 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods
  • 1999 Chartered Engineer, Member Engineers Ireland
  • 1999 Member, American Society of Mechanical Engineers

Education

  • 1994 University of Limerick - Ph.D.
  • 1990 University of Limerick - Bachelor of Engineering

Award

  • 1990 - PEI Technologies Postgraduate Scholarship

Consultancy

  • - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)
  • - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)

Language

  • English
  • German

Publications

Book Chapters

1997

Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards
Punch, J; Davies, MRD
(1997) Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards
In Thermal Management of Electronic Systems III; pp. 262-268

1994

A Parametric Study of Heat Spreading Through Multiple Layer Substrates
PUNCH, J; DAVIES, M
(1994) A Parametric Study of Heat Spreading Through Multiple Layer Substrates
In Thermal Management of Electronic Systems; Netherlands : Kluwer pp. 159-168

1994

The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count
Davies, MRD; Punch, J; Moore, T; Lohan, J
(1994) The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count
In Thermal Management of Electronics Systems; pp. 287-297

1994

A Parametric Study of Heat Spreading Through Multiple Layer Substrates
Punch, J; Davies, MRD
(1994) A Parametric Study of Heat Spreading Through Multiple Layer Substrates
In Thermal Management of Electronic Systems; pp. 159-169

Peer Reviewed Journals

2013

Film thickness measurements in liquid-liquid slug flow regimes
Eain, MM,Egan, V,Punch, J
(2013) Film thickness measurements in liquid-liquid slug flow regimes
In International Journal Of Heat And Fluid Flow; pp. 515-523
DOI: 10.1016/j.ijheatfluidflow.2013.08.009

2013

Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
Herkommer, D,Punch, J,Reid, M
(2013) Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
In Ieee Transactions On Components Packaging And Manufacturing Technology; pp. 275-281
DOI: 10.1109/TCPMT.2012.2227481

2012

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Kumari, N,Cader, T
(2012) From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
In Journal Of Electronic Packaging;
DOI: 10.1115/1.4007744

2012

Surface finish effect on reliability of SAC 305 soldered chip resistors
Collins, MN,Punch, J,Coyle, R
(2012) Surface finish effect on reliability of SAC 305 soldered chip resistors
In Soldering & Surface Mount Technology; pp. 240-248
DOI: 10.1108/09540911211262520

2012

Testing method for measuring corrosion resistance of surface mount chip resistors
Reid, M,Collins, MN,Dalton, E,Punch, J,Tanner, DA
(2012) Testing method for measuring corrosion resistance of surface mount chip resistors
In Microelectronics Reliability; pp. 1420-1427
DOI: 10.1016/j.microrel.2012.02.020

2012

Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors
Collins, M.N., Punch, J. and Coyle, R.,
(2012) Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors
In Soldering & Surface Mount Technology; pp. 240-248

2012

Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments
Hannigan, K,Reid, M,Collins, MN,Dalton, E,Xu, C,Wright, B,Demirkan, K,Opila, RL,Reents, WD,Franey, JP,Fleming, DA,Punch, J
(2012) Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments
In Journal Of Electronic Materials; pp. 611-623
DOI: 10.1007/s11664-011-1799-2

2012

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Rubenstein, B,Heath, S,Kumari, N
(2012) From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
In Journal Of Electronic Packaging;
DOI: 10.1115/1.4007110

2011

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE
(2011) From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
In Journal Of Electronic Packaging;
DOI: 10.1115/1.4004657

2011

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
Collins, MN; Punch, J; Coyle, R; Reid, M; Popowich, R; Read, P; Fleming, D
(2011) Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
In Ieee Transactions On Components Packaging And Manufacturing Technology; pp. 1594-1600
DOI: 10.1109/TCPMT.2011.2150223

2011

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE
(2011) From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
In Journal Of Electronic Packaging;
DOI: 10.1115/1.4003274

2011

Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S
(2011) Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
In Ieee Transactions On Components Packaging And Manufacturing Technology; pp. 1583-1593
DOI: 10.1109/TCPMT.2011.2140109

2010

Shock pulse shaping in a small-form factor velocity amplifier
Kelly, G; Punch, J; Goyal, S; Sheehy, M
(2010) Shock pulse shaping in a small-form factor velocity amplifier
In Shock And Vibration; pp. 787-802
DOI: 10.3233/SAV-2010-0521

2010

A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
Herkommer, D; Punch, J; Reid, M
(2010) A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
In Microelectronics Reliability; pp. 116-126
DOI: 10.1016/j.microrel.2009.08.008

2010

Corrosion of Cu under Highly Corrosive Environments
Demirkan, K; Derkits, GE; Fleming, DA; Franey, JP; Hannigan, K; Opila, RL; Punch, J; Reents, WD; Reid, M; Wright, B; Xu, C
(2010) Corrosion of Cu under Highly Corrosive Environments
In Journal Of The Electrochemical Society; pp. C30-C35
DOI: 10.1149/1.3258288

2010

Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets
Jeffers N.M.R., Punch J., Walsh E.J., Mclean M.
(2010) Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets
In Journal Of Thermal Science And Engineering Applications;
DOI: 10.1115/1.4003220

2010

Energy Scavenging for Energy Efficiency in Networks and Applications
Kim, KJ; Cottone, F; Goyal, S; Punch, J
(2010) Energy Scavenging for Energy Efficiency in Networks and Applications
In Bell Labs Technical Journal; pp. 7-29
DOI: 10.1002/bltj.20438

2009

In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Reid, M; Punch, J
(2009) In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples
In Journal Of Electronic Materials; pp. 2085-2095
DOI: 10.1007/s11664-009-0885-1

2009

Acoustic Emissions From Active Cooling Solutions for Portable Devices
Walsh, E; Walsh, P; Punch, J; Grimes, R
(2009) Acoustic Emissions From Active Cooling Solutions for Portable Devices
In Ieee Transactions On Components And Packaging Technologies; pp. 776-783
DOI: 10.1109/TCAPT.2009.2027605

2009

Pressure drop in two phase slug/bubble flows in mini scale capillaries
Walsh, E; Muzychka, Y; Walsh, P; Egan, V; Punch, J
(2009) Pressure drop in two phase slug/bubble flows in mini scale capillaries
In International Journal Of Multiphase Flow; pp. 879-884
DOI: 10.1016/j.ijmultiphaseflow.2009.06.007

2009

An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps
Kearney, D; Punch, J; Grimes, R
(2009) An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps
In Asme Journal Of Fluids Engineering;

2009

The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli
Sheehy, M; Punch, J; Goyal, S; Reid, M; Lishchynska, M; Kelly, G
(2009) The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli
In Strain; pp. 283-294
DOI: 10.1111/j.1475-1305.2008.00610.x

2009

Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Punch, J; Reid, M
(2009) Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
In Ieee Transactions And Packaging Technologies;

2009

A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples
Herkommer, D; Reid, M; Punch, J
(2009) A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples
In Ieee Transactions On Components And Packaging Technologies; pp. 800-807
DOI: 10.1109/TCAPT.2009.2014071

2008

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
Reid, M; Punch, J; Collins, M; Ryan, C
(2008) Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
In Soldering & Surface Mount Technology; pp. 3-8
DOI: 10.1108/09540910810902651

2008

Friction factor and heat transfer in multiple microchannels with uniform flow distribution
Park, HS; Punch, J
(2008) Friction factor and heat transfer in multiple microchannels with uniform flow distribution
In International Journal Of Heat And Mass Transfer; pp. 4535-4543
DOI: 10.1016/j.ijheatmasstransfer.2008.02.009

2008

Study of mixed flowing gas exposure of copper
Reid, M; Punch, J; Garfias-Mesias, LF; Shannon, K; Belochapkine, S; Tanner, DA
(2008) Study of mixed flowing gas exposure of copper
In Journal Of The Electrochemical Society; pp. C147-C153
DOI: 10.1149/1.2837834
[ULIR]

2007

Microstructural development of copper sulfide on copper exposed to humid H2S
Reid, M; Punch, J; Ryan, C; Garfias, LF; Belochapkine, S; Franey, JP; Derkits, GE; Reents, WD
(2007) Microstructural development of copper sulfide on copper exposed to humid H2S
In Journal Of The Electrochemical Society; pp. C209-C214
DOI: 10.1149/1.2436612

2007

The corrosion of electronic resistors
Reid, M; Punch, J; Ryan, C; Franey, J; Derkits, GE; Reents, WD; Garfias, LF
(2007) The corrosion of electronic resistors
In Ieee Transactions On Components And Packaging Technologies; pp. 666-672
DOI: 10.1109/TCAPT.2007.901749

2006

Corrosion resistance of copper-coated contacts
Reid, M; Punch, J; Grace, G; Garfias, LF; Belochapkine, S
(2006) Corrosion resistance of copper-coated contacts
In Journal Of The Electrochemical Society; pp. B513-B517
DOI: 10.1149/1.2352042

2006

Piecewise analysis and modeling of circuit pack temperature cycling data
Joyce, T. and Lisay Jr, E.J. and Dalton, D.E. and Punch, J.M. and Shellmer, M.S. and Kher, S.N. and Goyal, S.
(2006) Piecewise analysis and modeling of circuit pack temperature cycling data
In Bell Labs Technical Journal; pp. 21-37

2003

A board level study of an array of ball grid components
Cole, R; Davies, M; Punch, J
(2003) A board level study of an array of ball grid components
In Journal Of Electronic Packaging; pp. 480-489
DOI: 10.1115/1.1604811

2001

Modeling electronic cooling axial fan flows
Grimes, R; Davies, M; Punch, J; Dalton, T; Cole, R
(2001) Modeling electronic cooling axial fan flows
In Journal Of Electronic Packaging; pp. 112-119
DOI: 10.1115/1.1339821

2001

Forced Convection Board Level Thermal Design Methodology
Cole, R., Dalton, T., Punch, J., Davies, M., and Grimes, R.
(2001) Forced Convection Board Level Thermal Design Methodology
In J. Electronic Packaging; pp. 120-126

2001

Forced convection board level thermal design methodology for electronic systems
Cole, R; Dalton, T; Punch, J; Davie, MR; Grimes, R
(2001) Forced convection board level thermal design methodology for electronic systems
In Journal Of Electronic Packaging; pp. 120-126
DOI: 10.1115/1.1339822

1995

Electronics Cooling
Punch, J
(1995) Electronics Cooling
In The Irish Scientist; pp. 64-

1993

Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.
Punch, J; Davies, MRD
(1993) Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.
In American Society Of Mechanical Engineers; pp. 89-100

Other Journals

2006

Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques)
Punch, J
(2006) Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques)
In Acoustique et Techniques; pp. 34-40

Conference Publications

2011

ASME International Mechanical Engineering Congress and Exposition (IMECE)
Mac Giolla Eain M., Egan V., Punch J.
(2011) ASME International Mechanical Engineering Congress and Exposition (IMECE)

2010

IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1
Herkommer, D; Punch, J; Reid, M
(2010) IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1
pp. 737-742
DOI: 10.1115/InterPACK2009-89105

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Breen T.J., Walsh E.J., Punch J., Shah A.J., Bash C.E.
(2010) 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

DOI: 10.1109/ITHERM.2010.5501421

2010

IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5
Burke, C; Punch, J
(2010) IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5
pp. 121-129
DOI: 10.1115/IMECE2009-12135

2010

2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS
Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE
(2010) 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

DOI: 10.1109/ITHERM.2010.5501421

2010

ASME International Mechanical Engineering Congress and Exposition, Proceedings
Burke C., Punch J.
(2010) ASME International Mechanical Engineering Congress and Exposition, Proceedings
pp. 121-129

2010

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Punch J., Walsh E., Grimes R., Jeffers N., Kearney D.
(2010) 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

DOI: 10.1109/ESIME.2010.5464505

2010

2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE
(2010) 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

DOI: 10.1109/ITHERM.2010.5501422

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Walsh E.J., Breen T.J., Punch J., Shah A.J., Bash C.E.
(2010) 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

DOI: 10.1109/ITHERM.2010.5501422

2009

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Herkommer D., Reid M., Punch J.
(2009) 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

DOI: 10.1109/ESIME.2009.4938429

2009

2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
Kearney D., Punch J., Grimes R.
(2009) 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
pp. 755-764

2009

HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
Kearney, D; Punch, J; Grimes, R
(2009) HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
pp. 755-764

2009

HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1
Jeffers, N; Punch, J; Walsh, E
(2009) HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1
pp. 865-875

2009

HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
Jeffers, N; Punch, J; Walsh, E
(2009) HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
pp. 709-717

2009

EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
Herkommer, D; Reid, M; Punch, J
(2009) EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
pp. 281-288

2009

IEEE Electronic Components and Technology Conference
Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I.
(2009) IEEE Electronic Components and Technology Conference
pp. 423-430
DOI: 10.1109/ECTC.2009.5074048

2008

Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Sheehy M., Lishchynska M., Punch J., Goyal S., Kelly G.
(2008) Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
pp. 355-362

2008

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Punch J.
(2008) EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

DOI: 10.1109/ESIME.2008.4525110

2008

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Herkommer D., Reid M., Punch J.
(2008) EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

DOI: 10.1109/ESIME.2008.4525011

2008

DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS
Sheehy, M; Reid, M; Punch, J; Goyal, S; Kelly, G
(2008) DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS
pp. 2-7

2008

EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3
Herkommer, D; Reid, M; Punch, J
(2008) EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3
pp. 506-515

2008

Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Kelly G., Punch J., Goyal S., Sheehy M.
(2008) Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
pp. 782-791

2008

2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3
Walsh, EJ; Walsh, PA; Grimes, R; Punch, J
(2008) 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3
pp. 464-470

2007

2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Razeeb K.M., Munari A., Dalton E., Punch J., Roy S.
(2007) 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
pp. 817-823

2007

Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
Kelly G., Sheehy M., Rodgers B., Punch J., Goyal S.
(2007) Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
pp. 943-952

2007

PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2
Kearney, D; Punch, J; Grimes, R
(2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2
pp. 893-900

2007

PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
Grimes, R; Quin, D; Walsh, E; Punch, J
(2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
pp. 275-281

2007

ASME-JSME Thermal Engineering and Summer Heat Transfer Conference
Walsh, EJ; Walsh, P; Grimes, R; Punch, J; Egan, V
(2007) ASME-JSME Thermal Engineering and Summer Heat Transfer Conference
(Ed.) Vancouver, Canada

2007

Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
Sheehy M., Kelly G., Rodgers B., Punch J., Goyal S.
(2007) Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
pp. 1236-1243

2007

PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
Jeffers, N; Punch, J; Walsh, E
(2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
pp. 267-274

2006

Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems
Sheehy M., Punch J., Rodgers B., Goyal S.
(2006) Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems

2006

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Punch J., Grimes R., Heaslip G., Galkin T., Vakevainen K., Kyyhkynen V., Elonen E.
(2006) Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
pp. 2303-2308

2006

American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED
Kearney D., Punch J., Grimes R.
(2006) American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED

2006

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Kelly G.A., Punch J.M., Goyal S.
(2006) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

2005

Advances in Electronic Packaging 2005, Pts A-C
Ryan, C; Rodgers, BA; Punch, JM
(2005) Advances in Electronic Packaging 2005, Pts A-C
pp. 1223-1228

2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Reid, M; Punch, J; Galkin, T; Vakevainen, K; Stenberg, T; Vilen, M; Pomeroy, MJ; Mihov, M
(2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
pp. 330-334

2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Punch, J
(2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
pp. 688-694

2005

ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C
Heaslip, G; Punch, J; Rodgers, B; Ryan, C; Reid, M
(2005) ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C
pp. 1283-1291

2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E
(2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
pp. 398-405

2005

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
Heaslip, GM; Punch, JM; Rodgers, BA; Ryan, C; Reid, M
(2005) THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
pp. 277-284

2005

2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL
Reid, M; Punch, J; Rodgers, B; Pomeroy, MJ; Galkin, T; Stenberg, T; Rusanen, O; Elonenc, E; Vilen, M; Vakevainen, K
(2005) 2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL
pp. 300-304

2005

Advances in Electronic Packaging 2005, Pts A-C
Reid, M; Punch, J; Rodgers, B; Galkin, T; Stenberg, T; Rusanenc, O; Elonen, E; Vilen, M; Vakevainen, K
(2005) Advances in Electronic Packaging 2005, Pts A-C
pp. 1271-1276

2005

Advances in Electronic Packaging 2005, Pts A-C
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E
(2005) Advances in Electronic Packaging 2005, Pts A-C
pp. 2303-2308

2005

HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4
Hanly, K; Grimes, R; Walsh, E; Rodgers, B; Punch, J
(2005) HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4
pp. 549-+

2005

Advances in Electronic Packaging 2005, Pts A-C
Rodgers, B; Flood, B; Punch, J; Waldron, F
(2005) Advances in Electronic Packaging 2005, Pts A-C
pp. 1263-1270

2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Rodgers, B; Flood, B; Punch, J; Waldron, F
(2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
pp. 490-496

2005

HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E
(2005) HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4
pp. 871-876

2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Ryan, C; Punch, J; Rodgers, B
(2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
pp. 436-440

2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Heaslip G.M., Punch J.M., Rodgers B.A., Ryan C.
(2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
pp. 353-362

2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Rodgers B., Ryan C., Punch J., Waldron F., Floyd L.
(2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
pp. 153-159

2004

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Punch J., Rodgers B., Newport D., Davies M.
(2004) American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
In American Society Of Mechanical Engineers, Heat Transfer Division, (Publication) Htd; pp. 661-668

2004

ITHERM 2004, VOL 2
Ryan, C; ONeill, S; Donovan, J; Punch, J; Rodgers, B; Murphy, E
(2004) ITHERM 2004, VOL 2
pp. 664-668

2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Ryan C., Rodgers B., Punch J.M., Heaslip G., Murphy E., O'Neill S.
(2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
pp. 187-195

2004

2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS
Griffin, P; Leahy, JJ; Punch, J; Galkin, T; Elonen, E; Rusanen, O
(2004) 2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS
pp. 242-250

2003

ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003
Heaslip, GM; Punch, JM
(2003) ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003
pp. 125-133

2003

Proceedings of the Annual Reliability and Maintainability Symposium
Donovan J., Loll V., Punch J.
(2003) Proceedings of the Annual Reliability and Maintainability Symposium
pp. 528-533

2002

ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS
Rodgers, B; Punch, J; Jarvis, J; Myllykoski, P; Reinikainen, T
(2002) ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS
pp. 993-1000

2001

Proceedings of the National Heat Transfer Conference
Cole R., Davies M., Punch J.
(2001) Proceedings of the National Heat Transfer Conference
pp. 105-113

2001

Proceedings of the National Heat Transfer Conference
Davies M., Cole R., Punch J.
(2001) Proceedings of the National Heat Transfer Conference
pp. 115-121

1994

THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS
DAVIES, M; LOHAN, J; PUNCH, J; MOORE, T
(1994) THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS
pp. 287-296

Conference Contributions





Other Items Published

2011

Cooling Device
Walsh, EJ; Walsh, PA; Grimes, R; Punch, J;
(2011) Cooling Device
In International Patent Offices;

2010

A Cooling Device
Walsh, EJ; Walsh, PA; Grimes, R; Punch, J
(2010) A Cooling Device
In International Patent Offices; Ireland, US, China, World :

2001

Thermal Roadmap of Portable Products
Dalton, TM; Newport, D; Punch, J; Grimes, R
(2001) Thermal Roadmap of Portable Products

1998

Industrial seminars on the Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, L; Dalton, T; Newport, D
(1998) Industrial seminars on the Thermal Management of Electronic Systems

1996

Lecture Series on Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, J
(1996) Lecture Series on Thermal Management of Electronic Systems

1994

Lecture Series on Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Dillon, P
(1994) Lecture Series on Thermal Management of Electronic Systems

1992

The Computer Products Guide to the Thermal Management of Power Converters
Punch, J; Davies, MRD
(1992) The Computer Products Guide to the Thermal Management of Power Converters

1991

Cooling Electronic Power Supplies
Davies, MRD; Rodgers, P; Punch, J
(1991) Cooling Electronic Power Supplies

1991

Cool Power
Davies, MRD; Rodgers, P; Punch, J
(1991) Cool Power

Editorials

2010

Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator
Jeffers, N; Punch, J; Walsh, E
(2010) Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator
pp. 177-178
DOI: 10.1007/s12650-010-0033-2

Thesiss

1994

The Thermal Behaviour of Multiple Layer Substrates
Punch, J
(1994) The Thermal Behaviour of Multiple Layer Substrates
University of Limerick : University of Limerick