Biography

Dr. Jeff Punch is the Assistant Dean for Research for the Faculty of Science and Engineering at the University of Limerick. He is also a faculty member within the School of Engineering. In terms of research, he directs the Stokes Laboratories at UL's Bernal Institute – a research group dedicated to education and innovation in mechanical engineering science – and he is a Funded Investigator of the SFI-funded CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems – with emphasis on thermal / energy management and reliability physics. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.

Research Interests

The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems – with particular emphasis on thermal / energy management and reliability physics.

Professional Activities

Committee

  • 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
  • 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
  • 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
  • 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
  • 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
  • 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
  • 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
  • 2005 American Society of Mechanical Engineers InterPack Conference 2005,
  • 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
  • 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
  • 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
  • 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
  • 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
  • EU FP7 ERC Starting Independent Investigator Grants,

Patent

  • 2003 US 6,671,755 - System for Data Capture from a Rotor
  • 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
  • 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
  • 2001 IE 20000403 - A Data Capture System
  • 2000 EP 1058092 - A Data Capture System
  • 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
  • 1999 IE 06/000129 - A Cooling Device

Employment

  • 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
  • 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
  • 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow

Association

  • 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods
  • 1999 Chartered Engineer, Member Engineers Ireland
  • 1999 Member, American Society of Mechanical Engineers

Education

  • 1994 University of Limerick - Ph.D.
  • 1990 University of Limerick - Bachelor of Engineering

Award

  • 1990 - PEI Technologies Postgraduate Scholarship

Consultancy

  • - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)
  • - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)

Language

  • English
  • German

Books

This author has not written any publications of this type yet.

Book Chapters

A Parametric Study of Heat Spreading Through Multiple Layer Substrates

Dr. Jeff Punch
1994
Netherlands
Kluwer
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Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards

Dr. Jeff Punch
1997
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The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count

Dr. Jeff Punch
1994
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A Parametric Study of Heat Spreading Through Multiple Layer Substrates

Dr. Jeff Punch
1994
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Edited Books

This author has not written any publications of this type yet.

Peer Reviewed Journals

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

Dr. Maurice Collins
Dr. Jeff Punch
Conor Ryan
2008
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Study of mixed flowing gas exposure of copper

Dr. David Tanner
Dr. Jeff Punch
2008
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Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.

Dr. Jeff Punch
1993
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Corrosion resistance of copper-coated contacts

Dr. Jeff Punch
2006
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Piecewise analysis and modeling of circuit pack temperature cycling data

Dr. Jeff Punch
2006
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Testing method for measuring corrosion resistance of surface mount chip resistors

Dr. Maurice Collins
Dr. Eric Dalton
Dr. Jeff Punch
2012
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Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

Dr. Jeff Punch
2013
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In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples

Dr. Jeff Punch
2009
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Shock pulse shaping in a small-form factor velocity amplifier

Dr. Jeff Punch
2010
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Pressure drop in two phase slug/bubble flows in mini scale capillaries

Dr. Patrick Walsh
Dr. Vanessa Egan
Dr. Jeff Punch
2009
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Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

Dr. Jeff Punch
2009
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Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors

Dr. Jeff Punch
2012
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An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps

Dr. Jeff Punch
2009
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Acoustic Emissions From Active Cooling Solutions for Portable Devices

Dr. Patrick Walsh
Dr. Ronan Grimes
Dr. Jeff Punch
2009
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From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Dr. Jeff Punch
2012
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The corrosion of electronic resistors

Dr. Jeff Punch
Conor Ryan
2007
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The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli

Dr. Jeff Punch
2009
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Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions

Dr. Maurice Collins
Dr. Jeff Punch
2011
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Forced convection board level thermal design methodology for electronic systems

Dr. Tara Dalton
Dr. Jeff Punch
2001
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From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Dr. Jeff Punch
2012
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A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples

Dr. Jeff Punch
2009
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Friction factor and heat transfer in multiple microchannels with uniform flow distribution

Dr. Jeff Punch
2008
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Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

Dr. Maurice Collins
Dr. Jeff Punch
2011
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Modeling electronic cooling axial fan flows

Dr. Tara Dalton
Dr. Jeff Punch
2001
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From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Dr. Jeff Punch
2011
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Electronics Cooling

Dr. Jeff Punch
1995
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A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Dr. Jeff Punch
2010
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Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments

Dr. Maurice Collins
Dr. Eric Dalton
Dr. Jeff Punch
2012
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Forced Convection Board Level Thermal Design Methodology

Dr. Tara Dalton
Dr. Ronan Grimes
Dr. Jeff Punch
2001
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From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Dr. Jeff Punch
2011
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Corrosion of Cu under Highly Corrosive Environments

Dr. Jeff Punch
2010
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Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets

Dr. Jeff Punch
2010
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Surface finish effect on reliability of SAC 305 soldered chip resistors

Dr. Maurice Collins
Dr. Jeff Punch
2012
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Film thickness measurements in liquid-liquid slug flow regimes

Dr. Vanessa Egan
Dr. Jeff Punch
2013
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A board level study of an array of ball grid components

Dr. Jeff Punch
2003
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Microstructural development of copper sulfide on copper exposed to humid H2S

Dr. Jeff Punch
Conor Ryan
2007
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Energy Scavenging for Energy Efficiency in Networks and Applications

Dr. Jeff Punch
2010
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Other Journals

Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques)

Dr. Jeff Punch
2006
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Conference Publications

ASME International Mechanical Engineering Congress and Exposition (IMECE)

Dr. Vanessa Egan
Dr. Jeff Punch
2011
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2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Dr. Ronan Grimes
Dr. Jeff Punch
2010
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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Dr. Jeff Punch
2010
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American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Dr. Jeff Punch
2006
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ITHERM 2004, VOL 2

Dr. Jeff Punch
Conor Ryan
2004
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2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS

Dr. Jeff Punch
Dr. James J Leahy
2004
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Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008

Dr. Jeff Punch
2008
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HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4

Dr. Ronan Grimes
Dr. Jeff Punch
2005
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Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Dr. Ronan Grimes
Dr. Jeff Punch
2006
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HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1

Dr. Jeff Punch
2009
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American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Dr. Jeff Punch
2004
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EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3

Dr. Jeff Punch
2008
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IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5

Dr. Jeff Punch
2010
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American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Dr. Jeff Punch
2004
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PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3

Dr. Ronan Grimes
Dr. Jeff Punch
2007
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American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED

Dr. Ronan Grimes
Dr. Jeff Punch
2006
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HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2

Dr. Jeff Punch
2009
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ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C

Dr. Jeff Punch
Conor Ryan
2005
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Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Dr. Jeff Punch
2005
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DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS

Dr. Jeff Punch
2008
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Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007

Dr. Jeff Punch
2007
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Advances in Electronic Packaging 2005, Pts A-C

Dr. Ronan Grimes
Dr. Jeff Punch
2005
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2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008

Dr. Ronan Grimes
Dr. Jeff Punch
2009
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PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3

Dr. Jeff Punch
2007
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Advances in Electronic Packaging 2005, Pts A-C

Dr. Jeff Punch
2005
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Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Dr. Jeff Punch
Conor Ryan
2005
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2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Dr. Jeff Punch
2009
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Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008

Dr. Jeff Punch
2008
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IEEE Electronic Components and Technology Conference

Dr. Maurice Collins
Dr. Jeff Punch
2009
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PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2

Dr. Ronan Grimes
Dr. Jeff Punch
2007
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American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Dr. Jeff Punch
2004
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Advances in Electronic Packaging 2005, Pts A-C

Dr. Jeff Punch
Conor Ryan
2005
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Advances in Electronic Packaging 2005, Pts A-C

Dr. Jeff Punch
2005
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Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Dr. Jeff Punch
2005
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EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Dr. Jeff Punch
2008
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Proceedings of the Annual Reliability and Maintainability Symposium

Dr. Jeff Punch
2003
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2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3

Dr. Patrick Walsh
Dr. Ronan Grimes
Dr. Jeff Punch
2008
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HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4

Dr. Ronan Grimes
Dr. Jeff Punch
2005
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2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

Dr. Jeff Punch
2010
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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Dr. Jeff Punch
Conor Ryan
2005
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ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS

Dr. Jeff Punch
2002
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2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL

Dr. Jeff Punch
2005
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EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Dr. Jeff Punch
2008
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Proceedings of the National Heat Transfer Conference

Dr. Jeff Punch
2001
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ASME-JSME Thermal Engineering and Summer Heat Transfer Conference

Dr. Patrick Walsh
Dr. Vanessa Egan
Dr. Ronan Grimes
Dr. Jeff Punch
2007
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HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2

Dr. Ronan Grimes
Dr. Jeff Punch
2009
Read more

2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

Dr. Jeff Punch
2010
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ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003

Dr. Jeff Punch
2003
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IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1

Dr. Jeff Punch
2010
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THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS

Dr. Jeff Punch
1994
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Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems

Dr. Jeff Punch
2006
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Proceedings of the National Heat Transfer Conference

Dr. Jeff Punch
2001
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2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007

Dr. Eric Dalton
Dr. Jeff Punch
2007
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Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Dr. Ronan Grimes
Dr. Jeff Punch
2005
Read more

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Dr. Jeff Punch
2010
Read more

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Dr. Jeff Punch
2004
Read more

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Dr. Jeff Punch
2005
Read more

EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Dr. Jeff Punch
2009
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Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007

Dr. Jeff Punch
2007
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ASME International Mechanical Engineering Congress and Exposition, Proceedings

Dr. Jeff Punch
2010
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Conference Contributions

This author has not written any publications of this type yet.

Published Reports

This author has not written any publications of this type yet.

Editorials

Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator

Dr. Jeff Punch
2010
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Book Reviews

This author has not written any publications of this type yet.

Other Publications

The Thermal Behaviour of Multiple Layer Substrates

Dr. Jeff Punch
1994
University of Limerick
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Industrial seminars on the Thermal Management of Electronic Systems

Dr. Jeff Punch
1998
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Lecture Series on Thermal Management of Electronic Systems

Dr. Jeff Punch
1996
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Lecture Series on Thermal Management of Electronic Systems

Dr. Jeff Punch
1994
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A Cooling Device

Dr. Patrick Walsh
Dr. Ronan Grimes
Dr. Jeff Punch
2010
Ireland, US, China, World
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The Computer Products Guide to the Thermal Management of Power Converters

Dr. Jeff Punch
1992
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Cooling Device

Dr. Patrick Walsh
Dr. Ronan Grimes
Dr. Jeff Punch
2011
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Thermal Roadmap of Portable Products

Dr. Ronan Grimes
Dr. Jeff Punch
2001
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Cooling Electronic Power Supplies

Dr. Jeff Punch
1991
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Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator

Dr. Jeff Punch
2010
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