Dr. Jeff Punch
Biography
Prof. Jeff Punch is a faculty member of the School of Engineering at the University of Limerick, specialising in the thermal sciences. In terms of research, he directs the Stokes Laboratories at UL's Bernal Institute a research group dedicated to education and innovation in mechanical engineering science and he is a Funded Investigator of the SFI's CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems with emphasis on thermal / energy management and reliability physics.He has won over 10 million in industrial and research funding to date, and is currently supervising five postgraduate students and mentoring three postdoctoral researchers. He has authored or co-authored well over 150 refereed publications and five patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.Research Interests
The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems with particular emphasis on thermal / energy management and reliability physics.Professional Activities
Committee
- 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
- 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
- 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
- 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
- 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
- 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
- 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
- 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
- 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
- 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
- 2005 American Society of Mechanical Engineers InterPack Conference 2005,
- 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
- 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
- EU FP7 ERC Starting Independent Investigator Grants,
Patent
- 2003 US 6,671,755 - System for Data Capture from a Rotor
- 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
- 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
- 2001 IE 20000403 - A Data Capture System
- 2000 EP 1058092 - A Data Capture System
- 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
- 1999 IE 06/000129 - A Cooling Device
Employment
- 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
- 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
- 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow
Association
- 1999 Member, American Society of Mechanical Engineers
- 1999 Chartered Engineer, Member Engineers Ireland
- 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods
Education
- 1994 University of Limerick - Ph.D.
- 1990 University of Limerick - Bachelor of Engineering
Award
- 1990 - PEI Technologies Postgraduate Scholarship
Consultancy
- - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)
- - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)
Language
- English
- German
Peer Reviewed Journals
Film thickness measurements in liquid-liquid slug flow regimes
Eain, MM,Egan, V,Punch, J (2013) Film thickness measurements in liquid-liquid slug flow regimes. International Journal Of Heat And Fluid Flow :515-523
Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
Herkommer, D,Punch, J,Reid, M (2013) Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples. Ieee Transactions On Components Packaging And Manufacturing Technology :275-281
Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors
Collins, M.N., Punch, J. and Coyle, R., (2012) Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors. Soldering & Surface Mount Technology :240-248
Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments
Hannigan, K,Reid, M,Collins, MN,Dalton, E,Xu, C,Wright, B,Demirkan, K,Opila, RL,Reents, WD,Franey, JP,Fleming, DA,Punch, J (2012) Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments. Journal Of Electronic Materials :611-623
Surface finish effect on reliability of SAC 305 soldered chip resistors
Collins, MN,Punch, J,Coyle, R (2012) Surface finish effect on reliability of SAC 305 soldered chip resistors. Soldering & Surface Mount Technology :240-248
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Rubenstein, B,Heath, S,Kumari, N (2012) From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency. Journal Of Electronic Packaging
Testing method for measuring corrosion resistance of surface mount chip resistors
Reid, M,Collins, MN,Dalton, E,Punch, J,Tanner, DA (2012) Testing method for measuring corrosion resistance of surface mount chip resistors. Microelectronics Reliability :1420-1427
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Kumari, N,Cader, T (2012) From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency. Journal Of Electronic Packaging
Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
Collins, MN; Punch, J; Coyle, R; Reid, M; Popowich, R; Read, P; Fleming, D (2011) Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions. Ieee Transactions On Components Packaging And Manufacturing Technology :1594-1600
Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S (2011) Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints. Ieee Transactions On Components Packaging And Manufacturing Technology :1583-1593
From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE (2011) From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy. Journal Of Electronic Packaging
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE (2011) From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet. Journal Of Electronic Packaging
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
Herkommer, D; Punch, J; Reid, M (2010) A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions. Microelectronics Reliability :116-126
Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets
Jeffers N.M.R., Punch J., Walsh E.J., Mclean M. (2010) Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets. Journal Of Thermal Science And Engineering Applications
Energy Scavenging for Energy Efficiency in Networks and Applications
Kim, KJ; Cottone, F; Goyal, S; Punch, J (2010) Energy Scavenging for Energy Efficiency in Networks and Applications. Bell Labs Technical Journal :7-29
Corrosion of Cu under Highly Corrosive Environments
Demirkan, K; Derkits, GE; Fleming, DA; Franey, JP; Hannigan, K; Opila, RL; Punch, J; Reents, WD; Reid, M; Wright, B; Xu, C (2010) Corrosion of Cu under Highly Corrosive Environments. Journal Of The Electrochemical Society :C30-C35
Shock pulse shaping in a small-form factor velocity amplifier
Kelly, G; Punch, J; Goyal, S; Sheehy, M (2010) Shock pulse shaping in a small-form factor velocity amplifier. Shock And Vibration :787-802
The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli
Sheehy, M; Punch, J; Goyal, S; Reid, M; Lishchynska, M; Kelly, G (2009) The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli. Strain :283-294
In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Reid, M; Punch, J (2009) In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples. Journal Of Electronic Materials :2085-2095
A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples
Herkommer, D; Reid, M; Punch, J (2009) A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples. Ieee Transactions On Components And Packaging Technologies :800-807
Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Punch, J; Reid, M (2009) Constitutive Modelling of Joint-Scale SAC Solder Shear Samples. Ieee Transactions And Packaging Technologies
Pressure drop in two phase slug/bubble flows in mini scale capillaries
Walsh, E; Muzychka, Y; Walsh, P; Egan, V; Punch, J (2009) Pressure drop in two phase slug/bubble flows in mini scale capillaries. International Journal Of Multiphase Flow :879-884
Acoustic Emissions From Active Cooling Solutions for Portable Devices
Walsh, E; Walsh, P; Punch, J; Grimes, R (2009) Acoustic Emissions From Active Cooling Solutions for Portable Devices. Ieee Transactions On Components And Packaging Technologies :776-783
An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps
Kearney, D; Punch, J; Grimes, R (2009) An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps. Asme Journal Of Fluids Engineering
Friction factor and heat transfer in multiple microchannels with uniform flow distribution
Park, HS; Punch, J (2008) Friction factor and heat transfer in multiple microchannels with uniform flow distribution. International Journal Of Heat And Mass Transfer :4535-4543
Study of mixed flowing gas exposure of copper
Reid, M; Punch, J; Garfias-Mesias, LF; Shannon, K; Belochapkine, S; Tanner, DA (2008) Study of mixed flowing gas exposure of copper. Journal Of The Electrochemical Society :C147-C153
Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
Reid, M; Punch, J; Collins, M; Ryan, C (2008) Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys. Soldering & Surface Mount Technology :3-8
The corrosion of electronic resistors
Reid, M; Punch, J; Ryan, C; Franey, J; Derkits, GE; Reents, WD; Garfias, LF (2007) The corrosion of electronic resistors. Ieee Transactions On Components And Packaging Technologies :666-672
Microstructural development of copper sulfide on copper exposed to humid H2S
Reid, M; Punch, J; Ryan, C; Garfias, LF; Belochapkine, S; Franey, JP; Derkits, GE; Reents, WD (2007) Microstructural development of copper sulfide on copper exposed to humid H2S. Journal Of The Electrochemical Society :C209-C214
Piecewise analysis and modeling of circuit pack temperature cycling data
Joyce, T. and Lisay Jr, E.J. and Dalton, D.E. and Punch, J.M. and Shellmer, M.S. and Kher, S.N. and Goyal, S. (2006) Piecewise analysis and modeling of circuit pack temperature cycling data. Bell Labs Technical Journal :21-37
Corrosion resistance of copper-coated contacts
Reid, M; Punch, J; Grace, G; Garfias, LF; Belochapkine, S (2006) Corrosion resistance of copper-coated contacts. Journal Of The Electrochemical Society :B513-B517
A board level study of an array of ball grid components
Cole, R; Davies, M; Punch, J (2003) A board level study of an array of ball grid components. Journal Of Electronic Packaging :480-489
Forced Convection Board Level Thermal Design Methodology
Cole, R., Dalton, T., Punch, J., Davies, M., and Grimes, R. (2001) Forced Convection Board Level Thermal Design Methodology. J. Electronic Packaging :120-126
Forced convection board level thermal design methodology for electronic systems
Cole, R; Dalton, T; Punch, J; Davie, MR; Grimes, R (2001) Forced convection board level thermal design methodology for electronic systems. Journal Of Electronic Packaging :120-126
Modeling electronic cooling axial fan flows
Grimes, R; Davies, M; Punch, J; Dalton, T; Cole, R (2001) Modeling electronic cooling axial fan flows. Journal Of Electronic Packaging :112-119
Electronics Cooling
Punch, J (1995) Electronics Cooling. The Irish Scientist :64-
Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.
Punch, J; Davies, MRD (1993) Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.. American Society Of Mechanical Engineers :89-100
Books
Book Chapters
Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards
Punch, J; Davies, MRD (1997) Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards. Thermal Management of Electronic Systems III :262-268
A Parametric Study of Heat Spreading Through Multiple Layer Substrates
PUNCH, J; DAVIES, M (1994) A Parametric Study of Heat Spreading Through Multiple Layer Substrates. Netherlands : Kluwer Thermal Management of Electronic Systems :159-168
The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count
Davies, MRD; Punch, J; Moore, T; Lohan, J (1994) The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count. Thermal Management of Electronics Systems :287-297
A Parametric Study of Heat Spreading Through Multiple Layer Substrates
Punch, J; Davies, MRD (1994) A Parametric Study of Heat Spreading Through Multiple Layer Substrates. Thermal Management of Electronic Systems :159-169
Edited Books
Other Journals
Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques)
Punch, J (2006) Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques). Acoustique et Techniques :34-40
Conference Publications
ASME International Mechanical Engineering Congress and Exposition (IMECE)
Mac Giolla Eain M., Egan V., Punch J. (2011) ASME International Mechanical Engineering Congress and Exposition (IMECE) .
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Punch J., Walsh E., Grimes R., Jeffers N., Kearney D. (2010) 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010.
IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1
Herkommer, D; Punch, J; Reid, M (2010) IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1. :737-742
IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5
Burke, C; Punch, J (2010) IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5. :121-129
ASME International Mechanical Engineering Congress and Exposition, Proceedings
Burke C., Punch J. (2010) ASME International Mechanical Engineering Congress and Exposition, Proceedings. :121-129
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS
Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE (2010) 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS.
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE (2010) 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS.
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Walsh E.J., Breen T.J., Punch J., Shah A.J., Bash C.E. (2010) 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010.
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Breen T.J., Walsh E.J., Punch J., Shah A.J., Bash C.E. (2010) 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010.
HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
Kearney, D; Punch, J; Grimes, R (2009) HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2. :755-764
HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1
Jeffers, N; Punch, J; Walsh, E (2009) HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1. :865-875
IEEE Electronic Components and Technology Conference
Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I. (2009) IEEE Electronic Components and Technology Conference. :423-430
EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
Herkommer, D; Reid, M; Punch, J (2009) EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS. :281-288
HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
Jeffers, N; Punch, J; Walsh, E (2009) HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2. :709-717
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Herkommer D., Reid M., Punch J. (2009) 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009.
2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
Kearney D., Punch J., Grimes R. (2009) 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008. :755-764
2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3
Walsh, EJ; Walsh, PA; Grimes, R; Punch, J (2008) 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3. :464-470
Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Kelly G., Punch J., Goyal S., Sheehy M. (2008) Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008. :782-791
DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS
Sheehy, M; Reid, M; Punch, J; Goyal, S; Kelly, G (2008) DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. :2-7
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3
Herkommer, D; Reid, M; Punch, J (2008) EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3. :506-515
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Punch J. (2008) EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Herkommer D., Reid M., Punch J. (2008) EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Sheehy M., Lishchynska M., Punch J., Goyal S., Kelly G. (2008) Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008. :355-362
Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
Kelly G., Sheehy M., Rodgers B., Punch J., Goyal S. (2007) Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007. :943-952
PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
Jeffers, N; Punch, J; Walsh, E (2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3. :267-274
ASME-JSME Thermal Engineering and Summer Heat Transfer Conference
Walsh, EJ; Walsh, P; Grimes, R; Punch, J; Egan, V (2007) ASME-JSME Thermal Engineering and Summer Heat Transfer Conference.
2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Razeeb K.M., Munari A., Dalton E., Punch J., Roy S. (2007) 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007. :817-823
PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
Grimes, R; Quin, D; Walsh, E; Punch, J (2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3. :275-281
PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2
Kearney, D; Punch, J; Grimes, R (2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2. :893-900
Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007
Sheehy M., Kelly G., Rodgers B., Punch J., Goyal S. (2007) Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007. :1236-1243
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Punch J., Grimes R., Heaslip G., Galkin T., Vakevainen K., Kyyhkynen V., Elonen E. (2006) Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. :2303-2308
American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED
Kearney D., Punch J., Grimes R. (2006) American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED.
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Kelly G.A., Punch J.M., Goyal S. (2006) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP.
Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems
Sheehy M., Punch J., Rodgers B., Goyal S. (2006) Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems.
Advances in Electronic Packaging 2005, Pts A-C
Reid, M; Punch, J; Rodgers, B; Galkin, T; Stenberg, T; Rusanenc, O; Elonen, E; Vilen, M; Vakevainen, K (2005) Advances in Electronic Packaging 2005, Pts A-C. :1271-1276
Advances in Electronic Packaging 2005, Pts A-C
Rodgers, B; Flood, B; Punch, J; Waldron, F (2005) Advances in Electronic Packaging 2005, Pts A-C. :1263-1270
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :398-405
Advances in Electronic Packaging 2005, Pts A-C
Ryan, C; Rodgers, BA; Punch, JM (2005) Advances in Electronic Packaging 2005, Pts A-C. :1223-1228
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Punch, J (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :688-694
THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
Heaslip, GM; Punch, JM; Rodgers, BA; Ryan, C; Reid, M (2005) THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS. :277-284
HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4
Hanly, K; Grimes, R; Walsh, E; Rodgers, B; Punch, J (2005) HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4. :549-+
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Rodgers, B; Flood, B; Punch, J; Waldron, F (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :490-496
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Ryan, C; Punch, J; Rodgers, B (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :436-440
Advances in Electronic Packaging 2005, Pts A-C
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E (2005) Advances in Electronic Packaging 2005, Pts A-C. :2303-2308
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Reid, M; Punch, J; Galkin, T; Vakevainen, K; Stenberg, T; Vilen, M; Pomeroy, MJ; Mihov, M (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :330-334
ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C
Heaslip, G; Punch, J; Rodgers, B; Ryan, C; Reid, M (2005) ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C. :1283-1291
2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL
Reid, M; Punch, J; Rodgers, B; Pomeroy, MJ; Galkin, T; Stenberg, T; Rusanen, O; Elonenc, E; Vilen, M; Vakevainen, K (2005) 2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL. :300-304
HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E (2005) HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4. :871-876
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Rodgers B., Ryan C., Punch J., Waldron F., Floyd L. (2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. :153-159
2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS
Griffin, P; Leahy, JJ; Punch, J; Galkin, T; Elonen, E; Rusanen, O (2004) 2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS. :242-250
ITHERM 2004, VOL 2
Ryan, C; ONeill, S; Donovan, J; Punch, J; Rodgers, B; Murphy, E (2004) ITHERM 2004, VOL 2. :664-668
American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Punch J., Rodgers B., Newport D., Davies M. (2004) American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. American Society Of Mechanical Engineers, Heat Transfer Division, (Publication) Htd :661-668
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Ryan C., Rodgers B., Punch J.M., Heaslip G., Murphy E., O'Neill S. (2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. :187-195
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Heaslip G.M., Punch J.M., Rodgers B.A., Ryan C. (2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. :353-362
Proceedings of the Annual Reliability and Maintainability Symposium
Donovan J., Loll V., Punch J. (2003) Proceedings of the Annual Reliability and Maintainability Symposium. :528-533
ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003
Heaslip, GM; Punch, JM (2003) ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003. :125-133
ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS
Rodgers, B; Punch, J; Jarvis, J; Myllykoski, P; Reinikainen, T (2002) ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS. :993-1000
Proceedings of the National Heat Transfer Conference
Davies M., Cole R., Punch J. (2001) Proceedings of the National Heat Transfer Conference. :115-121
Proceedings of the National Heat Transfer Conference
Cole R., Davies M., Punch J. (2001) Proceedings of the National Heat Transfer Conference. :105-113
THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS
DAVIES, M; LOHAN, J; PUNCH, J; MOORE, T (1994) THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS. :287-296
Conference Contributions
Published Reports
Editorials
Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator
Jeffers, N; Punch, J; Walsh, E (2010) Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator. :177-178
Book Reviews
Other Publications
Cooling Device
Walsh, EJ; Walsh, PA; Grimes, R; Punch, J; (2011) Cooling Device. International Patent Offices
A Cooling Device
Walsh, EJ; Walsh, PA; Grimes, R; Punch, J (2010) A Cooling Device. Ireland, US, China, World International Patent Offices
Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator
Jeffers, N; Punch, J; Walsh, E (2010) Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator. :177-178
Thermal Roadmap of Portable Products
Dalton, TM; Newport, D; Punch, J; Grimes, R (2001) Thermal Roadmap of Portable Products.
Industrial seminars on the Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, L; Dalton, T; Newport, D (1998) Industrial seminars on the Thermal Management of Electronic Systems.
Lecture Series on Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, J (1996) Lecture Series on Thermal Management of Electronic Systems.
The Thermal Behaviour of Multiple Layer Substrates
Punch, J (1994) The Thermal Behaviour of Multiple Layer Substrates. University of Limerick
Lecture Series on Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Dillon, P (1994) Lecture Series on Thermal Management of Electronic Systems.
The Computer Products Guide to the Thermal Management of Power Converters
Punch, J; Davies, MRD (1992) The Computer Products Guide to the Thermal Management of Power Converters.
Cooling Electronic Power Supplies
Davies, MRD; Rodgers, P; Punch, J (1991) Cooling Electronic Power Supplies.
Cool Power
Davies, MRD; Rodgers, P; Punch, J (1991) Cool Power.