Biography
Dr. Jeff Punch is the Assistant Dean for Research for the Faculty of Science and Engineering at the University of Limerick. He is also a faculty member within the School of Engineering. In terms of research, he directs the Stokes Laboratories at UL's Bernal Institute a research group dedicated to education and innovation in mechanical engineering science and he is a Funded Investigator of the SFI-funded CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems with emphasis on thermal / energy management and reliability physics. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.
Research Interests
The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems with particular emphasis on thermal / energy management and reliability physics.
Professional Activities
Committee
- 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
- 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
- 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
- 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
- 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
- 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
- 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
- 2005 American Society of Mechanical Engineers InterPack Conference 2005,
- 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
- 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
- 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
- 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
- 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
- EU FP7 ERC Starting Independent Investigator Grants,
Patent
- 2003 US 6,671,755 - System for Data Capture from a Rotor
- 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
- 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
- 2001 IE 20000403 - A Data Capture System
- 2000 EP 1058092 - A Data Capture System
- 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
- 1999 IE 06/000129 - A Cooling Device
Employment
- 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
- 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
- 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow
Association
- 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods
- 1999 Chartered Engineer, Member Engineers Ireland
- 1999 Member, American Society of Mechanical Engineers
Education
- 1994 University of Limerick - Ph.D.
- 1990 University of Limerick - Bachelor of Engineering
Award
- 1990 - PEI Technologies Postgraduate Scholarship
Consultancy
- - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)
- - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)
Language
- English
- German
Publications
Conference Publication
ASME International Mechanical Engineering Congress and Exposition (IMECE)
Mac Giolla Eain M., Egan V., Punch J.
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Punch J., Walsh E., Grimes R., Jeffers N., Kearney D.
DOI: 10.1109/ESIME.2010.5464505
IEEE Electronic Components and Technology Conference
Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I.
DOI: 10.1109/ECTC.2009.5074048
2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
Kearney D., Punch J., Grimes R.
HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2
Kearney, D; Punch, J; Grimes, R
PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2
Kearney, D; Punch, J; Grimes, R
PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3
Grimes, R; Quin, D; Walsh, E; Punch, J
2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Razeeb K.M., Munari A., Dalton E., Punch J., Roy S.
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Punch J., Grimes R., Heaslip G., Galkin T., Vakevainen K., Kyyhkynen V., Elonen E.
American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED
Kearney D., Punch J., Grimes R.
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E
Advances in Electronic Packaging 2005, Pts A-C
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E
HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4
Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E
HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4
Hanly, K; Grimes, R; Walsh, E; Rodgers, B; Punch, J
Other Publication
Thermal Roadmap of Portable Products
Dalton, TM; Newport, D; Punch, J; Grimes, R
Peer Reviewed Journal
Film thickness measurements in liquid-liquid slug flow regimes
Eain, MM,Egan, V,Punch, J
International Journal Of Heat And Fluid Flow
DOI: 10.1016/j.ijheatfluidflow.2013.08.009
Testing method for measuring corrosion resistance of surface mount chip resistors
Reid, M,Collins, MN,Dalton, E,Punch, J,Tanner, DA
Microelectronics Reliability
DOI: 10.1016/j.microrel.2012.02.020
Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments
Hannigan, K,Reid, M,Collins, MN,Dalton, E,Xu, C,Wright, B,Demirkan, K,Opila, RL,Reents, WD,Franey, JP,Fleming, DA,Punch, J
Journal Of Electronic Materials
DOI: 10.1007/s11664-011-1799-2
Surface finish effect on reliability of SAC 305 soldered chip resistors
Collins, MN,Punch, J,Coyle, R
Soldering & Surface Mount Technology
DOI: 10.1108/09540911211262520
Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S
Ieee Transactions On Components Packaging And Manufacturing Technology
DOI: 10.1109/TCPMT.2011.2140109
Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
Collins, MN; Punch, J; Coyle, R; Reid, M; Popowich, R; Read, P; Fleming, D
Ieee Transactions On Components Packaging And Manufacturing Technology
DOI: 10.1109/TCPMT.2011.2150223
Forced convection board level thermal design methodology for electronic systems
Cole, R; Dalton, T; Punch, J; Davie, MR; Grimes, R
Journal Of Electronic Packaging
DOI: 10.1115/1.1339822
Forced Convection Board Level Thermal Design Methodology
Cole, R., Dalton, T., Punch, J., Davies, M., and Grimes, R.
J. Electronic Packaging
Modeling electronic cooling axial fan flows
Grimes, R; Davies, M; Punch, J; Dalton, T; Cole, R
Journal Of Electronic Packaging
DOI: 10.1115/1.1339821