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Dr Jeff Punch

Biography

Dr. Jeff Punch is the Assistant Dean for Research for the Faculty of Science and Engineering at the University of Limerick. He is also a faculty member within the School of Engineering. In terms of research, he directs the Stokes Laboratories at UL’s Bernal Institute – a research group dedicated to education and innovation in mechanical engineering science – and he is a Funded Investigator of the SFI-funded CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems – with emphasis on thermal / energy management and reliability physics. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.

Research Interests

The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems – with particular emphasis on thermal / energy management and reliability physics.

Professional Activities

Committee

  • 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
  • 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
  • 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
  • 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
  • 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
  • 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
  • 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
  • 2005 American Society of Mechanical Engineers InterPack Conference 2005,
  • 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
  • 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
  • 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
  • 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
  • 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
  • EU FP7 ERC Starting Independent Investigator Grants,

Patent

  • 2003 US 6,671,755 - System for Data Capture from a Rotor
  • 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
  • 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
  • 2001 IE 20000403 - A Data Capture System
  • 2000 EP 1058092 - A Data Capture System
  • 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
  • 1999 IE 06/000129 - A Cooling Device

Employment

  • 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
  • 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
  • 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow

Association

  • 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods
  • 1999 Chartered Engineer, Member Engineers Ireland
  • 1999 Member, American Society of Mechanical Engineers

Education

  • 1994 University of Limerick - Ph.D.
  • 1990 University of Limerick - Bachelor of Engineering

Award

  • 1990 - PEI Technologies Postgraduate Scholarship

Consultancy

  • - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)
  • - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)

Language

  • English
  • German

Publications

Book Chapter

1994

A Parametric Study of Heat Spreading Through Multiple Layer Substrates
PUNCH, J; DAVIES, M
Thermal Management of Electronic Systems

1994

A Parametric Study of Heat Spreading Through Multiple Layer Substrates
Punch, J; Davies, MRD
Thermal Management of Electronic Systems

Conference Contribution



Conference Publication

2009

IEEE Electronic Components and Technology Conference
Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I.
DOI: 10.1109/ECTC.2009.5074048

2008
2005

2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL
Reid, M; Punch, J; Rodgers, B; Pomeroy, MJ; Galkin, T; Stenberg, T; Rusanen, O; Elonenc, E; Vilen, M; Vakevainen, K

2005

Advances in Electronic Packaging 2005, Pts A-C
Reid, M; Punch, J; Rodgers, B; Galkin, T; Stenberg, T; Rusanenc, O; Elonen, E; Vilen, M; Vakevainen, K

2005

Advances in Electronic Packaging 2005, Pts A-C
Rodgers, B; Flood, B; Punch, J; Waldron, F

2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Reid, M; Punch, J; Galkin, T; Vakevainen, K; Stenberg, T; Vilen, M; Pomeroy, MJ; Mihov, M

2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Ryan C., Rodgers B., Punch J.M., Heaslip G., Murphy E., O'Neill S.

2004
2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Rodgers B., Ryan C., Punch J., Waldron F., Floyd L.

2004

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Punch J., Rodgers B., Newport D., Davies M.
American Society Of Mechanical Engineers, Heat Transfer Division, (Publication) Htd

2001
2001
1994

THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS
DAVIES, M; LOHAN, J; PUNCH, J; MOORE, T

Other Journal

Other Publication

1998

Industrial seminars on the Thermal Management of Electronic Systems
Punch, J; Davies, MRD; Lohan, L; Dalton, T; Newport, D

1996
1994
1991

Cool Power
Davies, MRD; Rodgers, P; Punch, J

1991

Cooling Electronic Power Supplies
Davies, MRD; Rodgers, P; Punch, J

Peer Reviewed Journal

2013

Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
Herkommer, D,Punch, J,Reid, M
Ieee Transactions On Components Packaging And Manufacturing Technology DOI: 10.1109/TCPMT.2012.2227481

2012

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Rubenstein, B,Heath, S,Kumari, N
Journal Of Electronic Packaging DOI: 10.1115/1.4007110

2012

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Kumari, N,Cader, T
Journal Of Electronic Packaging DOI: 10.1115/1.4007744

2012

Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors
Collins, M.N., Punch, J. and Coyle, R.,
Soldering & Surface Mount Technology

2012

Surface finish effect on reliability of SAC 305 soldered chip resistors
Collins, MN,Punch, J,Coyle, R
Soldering & Surface Mount Technology DOI: 10.1108/09540911211262520

2011

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE
Journal Of Electronic Packaging DOI: 10.1115/1.4004657

2011

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
Collins, MN; Punch, J; Coyle, R; Reid, M; Popowich, R; Read, P; Fleming, D
Ieee Transactions On Components Packaging And Manufacturing Technology DOI: 10.1109/TCPMT.2011.2150223

2011
2011

Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S
Ieee Transactions On Components Packaging And Manufacturing Technology DOI: 10.1109/TCPMT.2011.2140109

2010

Corrosion of Cu under Highly Corrosive Environments
Demirkan, K; Derkits, GE; Fleming, DA; Franey, JP; Hannigan, K; Opila, RL; Punch, J; Reents, WD; Reid, M; Wright, B; Xu, C
Journal Of The Electrochemical Society DOI: 10.1149/1.3258288

2010

Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets
Jeffers N.M.R., Punch J., Walsh E.J., Mclean M.
Journal Of Thermal Science And Engineering Applications DOI: 10.1115/1.4003220

2010

Shock pulse shaping in a small-form factor velocity amplifier
Kelly, G; Punch, J; Goyal, S; Sheehy, M
Shock And Vibration DOI: 10.3233/SAV-2010-0521

2010

Energy Scavenging for Energy Efficiency in Networks and Applications
Kim, KJ; Cottone, F; Goyal, S; Punch, J
Bell Labs Technical Journal DOI: 10.1002/bltj.20438

2009

The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli
Sheehy, M; Punch, J; Goyal, S; Reid, M; Lishchynska, M; Kelly, G
Strain DOI: 10.1111/j.1475-1305.2008.00610.x

2009

In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Reid, M; Punch, J
Journal Of Electronic Materials DOI: 10.1007/s11664-009-0885-1

2009
2009

Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Herkommer, D; Punch, J; Reid, M
Ieee Transactions And Packaging Technologies

2009

A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples
Herkommer, D; Reid, M; Punch, J
Ieee Transactions On Components And Packaging Technologies DOI: 10.1109/TCAPT.2009.2014071

2006

Piecewise analysis and modeling of circuit pack temperature cycling data
Joyce, T. and Lisay Jr, E.J. and Dalton, D.E. and Punch, J.M. and Shellmer, M.S. and Kher, S.N. and Goyal, S.
Bell Labs Technical Journal

2006

Corrosion resistance of copper-coated contacts
Reid, M; Punch, J; Grace, G; Garfias, LF; Belochapkine, S
Journal Of The Electrochemical Society DOI: 10.1149/1.2352042

2003

A board level study of an array of ball grid components
Cole, R; Davies, M; Punch, J
Journal Of Electronic Packaging DOI: 10.1115/1.1604811

1995

Electronics Cooling
Punch, J
The Irish Scientist

1993

Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.
Punch, J; Davies, MRD
American Society Of Mechanical Engineers