Biography

Dr. Jeff Punch is the Assistant Dean for Research for the Faculty of Science and Engineering at the University of Limerick. He is also a faculty member within the School of Engineering. In terms of research, he directs the Stokes Laboratories at UL's Bernal Institute – a research group dedicated to education and innovation in mechanical engineering science – and he is a Funded Investigator of the SFI-funded CONNECT Centre. He has wide-ranging research interests in the analysis of micro-scale mechanical engineering phenomena within the application areas of electronic and micro-electromechanical systems – with emphasis on thermal / energy management and reliability physics. He has authored or co-authored over 100 refereed publications and four patents, and has presented numerous invited talks on aspects of the thermal management and reliability of electronic systems at venues worldwide.

Research Interests

The analysis of micro-scale mechanical engineering phenomena within the application arenas of electronic and micro-electromechanical systems – with particular emphasis on thermal / energy management and reliability physics.

Professional Activities

Committee

  • 2009 American Society of Mechanical Engineers Heat Transfer Conference 2009,
  • 2008 Institute of Electrical and Electronic Engineers EuroSimE Conference 2008,
  • 2007 American Society of Mechanical Engineers Heat Transfer Conference 2007,
  • 2007 Belgian Government IWT SBO Scheme (Strategic Basic Research),
  • 2006 Enterprise Ireland Research Technology and Innovation (RTI) Scheme,
  • 2006 Enterprise Ireland / IDA: R&D Capability Scheme,
  • 2005 Enterprise Ireland Commercialisation Fund Proof-of-Concept Scheme (Chemistry / Engineering / Materials Panel),
  • 2005 American Society of Mechanical Engineers Heat Transfer Conference 2005,
  • 2005 Institute of Electrical and Electronic Engineers EuroSimE Conference 2005,
  • 2005 EU FP6 New and Emerging Science and Technology (NEST) Programme,
  • 2005 American Society of Mechanical Engineers InterPack Conference 2005,
  • 2003 Enterprise Ireland Basic Research Grant Scheme (Engineering Panel),
  • 2003 International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods,
  • EU FP7 ERC Starting Independent Investigator Grants,

Patent

  • 2003 US 6,671,755 - System for Data Capture from a Rotor
  • 2002 IE 20020981 - A Contrast Bathing Physiotherapy Device
  • 2002 EP 1321117 - A Contrast Bathing Physiotherapy Device
  • 2001 IE 20000403 - A Data Capture System
  • 2000 EP 1058092 - A Data Capture System
  • 1999 Pending - Impact-Tolerant Lead-Free Solder Interconnection Technologies
  • 1999 IE 06/000129 - A Cooling Device

Employment

  • 2000 Stokes Research Institute (Enterprise Ireland) - Director, Micro-Mechanical Engineering Research
  • 1995 PEI Technologies, Stokes Research Institute, UL - Senior Research Engineer and Research Centre Manager
  • 1994 Department of Mechanical and Aeronautical Engineer - Research Fellow and Senior Research Fellow

Association

  • 1999 Member, American Society of Mechanical Engineers
  • 1999 Chartered Engineer, Member Engineers Ireland
  • 1999 Member, International Electrotechnical Committee, Technical Committee 56, Working Group 2 (IEC TC56 WG2), Dependability Methods

Education

  • 1994 University of Limerick - Ph.D.
  • 1990 University of Limerick - Bachelor of Engineering

Award

  • 1990 - PEI Technologies Postgraduate Scholarship

Consultancy

  • - Over a decade of experience in consultancy on the thermal design of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Hewlett Packard, IPWireless, Analog Devices, Stratus Technologies, Tellabs Ltd., Xilinx Ireland, Philips Semiconductors, Excelsys Technologies, Artesyn Technologies, BMW, Thermacore, Flomerics Inc., Bookham Technology, Apple Computers, Agilent Technologies, COM21 Ireland, Pilz Computers, Avocent, Magnadon.)
  • - Experience in consultancy (over 5 years) on the reliability of electronic systems for miscellaneous industrial clients in Europe, Asia-Pacific and the USA (Sample clients: Nokia Corporation, Lucent Technologies, Molex Inc., Stratus Technologies, Cabletron Systems, NPB, Artesyn Technologies, Anecto, PowerOne.)

Language

  • English
  • German

Peer Reviewed Journals

2013

Film thickness measurements in liquid-liquid slug flow regimes

Eain, MM,Egan, V,Punch, J (2013) Film thickness measurements in liquid-liquid slug flow regimes. International Journal Of Heat And Fluid Flow :515-523

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2013

Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

Herkommer, D,Punch, J,Reid, M (2013) Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples. Ieee Transactions On Components Packaging And Manufacturing Technology :275-281

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2012

Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors

Collins, M.N., Punch, J. and Coyle, R., (2012) Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors. Soldering & Surface Mount Technology :240-248

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2012

Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments

Hannigan, K,Reid, M,Collins, MN,Dalton, E,Xu, C,Wright, B,Demirkan, K,Opila, RL,Reents, WD,Franey, JP,Fleming, DA,Punch, J (2012) Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments. Journal Of Electronic Materials :611-623

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2012

Surface finish effect on reliability of SAC 305 soldered chip resistors

Collins, MN,Punch, J,Coyle, R (2012) Surface finish effect on reliability of SAC 305 soldered chip resistors. Soldering & Surface Mount Technology :240-248

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2012

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Rubenstein, B,Heath, S,Kumari, N (2012) From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency. Journal Of Electronic Packaging

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2012

Testing method for measuring corrosion resistance of surface mount chip resistors

Reid, M,Collins, MN,Dalton, E,Punch, J,Tanner, DA (2012) Testing method for measuring corrosion resistance of surface mount chip resistors. Microelectronics Reliability :1420-1427

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2012

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Breen, TJ,Walsh, EJ,Punch, J,Shah, AJ,Bash, CE,Kumari, N,Cader, T (2012) From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency. Journal Of Electronic Packaging

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2011

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE (2011) From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy. Journal Of Electronic Packaging

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2011

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE (2011) From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet. Journal Of Electronic Packaging

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2011

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions

Collins, MN; Punch, J; Coyle, R; Reid, M; Popowich, R; Read, P; Fleming, D (2011) Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions. Ieee Transactions On Components Packaging And Manufacturing Technology :1594-1600

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2011

Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S (2011) Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints. Ieee Transactions On Components Packaging And Manufacturing Technology :1583-1593

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2010

Shock pulse shaping in a small-form factor velocity amplifier

Kelly, G; Punch, J; Goyal, S; Sheehy, M (2010) Shock pulse shaping in a small-form factor velocity amplifier. Shock And Vibration :787-802

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2010

A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Herkommer, D; Punch, J; Reid, M (2010) A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions. Microelectronics Reliability :116-126

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2010

Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets

Jeffers N.M.R., Punch J., Walsh E.J., Mclean M. (2010) Heat transfer from novel target surface structures to a 3 ÿ 3 array of normally impinging water jets. Journal Of Thermal Science And Engineering Applications

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2010

Energy Scavenging for Energy Efficiency in Networks and Applications

Kim, KJ; Cottone, F; Goyal, S; Punch, J (2010) Energy Scavenging for Energy Efficiency in Networks and Applications. Bell Labs Technical Journal :7-29

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2010

Corrosion of Cu under Highly Corrosive Environments

Demirkan, K; Derkits, GE; Fleming, DA; Franey, JP; Hannigan, K; Opila, RL; Punch, J; Reents, WD; Reid, M; Wright, B; Xu, C (2010) Corrosion of Cu under Highly Corrosive Environments. Journal Of The Electrochemical Society :C30-C35

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2009

Acoustic Emissions From Active Cooling Solutions for Portable Devices

Walsh, E; Walsh, P; Punch, J; Grimes, R (2009) Acoustic Emissions From Active Cooling Solutions for Portable Devices. Ieee Transactions On Components And Packaging Technologies :776-783

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2009

An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps

Kearney, D; Punch, J; Grimes, R (2009) An Experimental Investigation of the Flow Fields within Geometrically-Similar Miniature-Scale Centrifugal Pumps. Asme Journal Of Fluids Engineering

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2009

The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli

Sheehy, M; Punch, J; Goyal, S; Reid, M; Lishchynska, M; Kelly, G (2009) The Failure Mechanisms of Micro-Scale Cantilevers Under Shock and Vibration Stimuli. Strain :283-294

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2009

In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples

Herkommer, D; Reid, M; Punch, J (2009) In Situ Optical Creep Observation of Joint-Scale SAC Solder Shear Samples. Journal Of Electronic Materials :2085-2095

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2009

A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples

Herkommer, D; Reid, M; Punch, J (2009) A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples. Ieee Transactions On Components And Packaging Technologies :800-807

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2009

Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

Herkommer, D; Punch, J; Reid, M (2009) Constitutive Modelling of Joint-Scale SAC Solder Shear Samples. Ieee Transactions And Packaging Technologies

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2009

Pressure drop in two phase slug/bubble flows in mini scale capillaries

Walsh, E; Muzychka, Y; Walsh, P; Egan, V; Punch, J (2009) Pressure drop in two phase slug/bubble flows in mini scale capillaries. International Journal Of Multiphase Flow :879-884

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2008

Friction factor and heat transfer in multiple microchannels with uniform flow distribution

Park, HS; Punch, J (2008) Friction factor and heat transfer in multiple microchannels with uniform flow distribution. International Journal Of Heat And Mass Transfer :4535-4543

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2008

Study of mixed flowing gas exposure of copper

Reid, M; Punch, J; Garfias-Mesias, LF; Shannon, K; Belochapkine, S; Tanner, DA (2008) Study of mixed flowing gas exposure of copper. Journal Of The Electrochemical Society :C147-C153

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2008

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

Reid, M; Punch, J; Collins, M; Ryan, C (2008) Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys. Soldering & Surface Mount Technology :3-8

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2007

The corrosion of electronic resistors

Reid, M; Punch, J; Ryan, C; Franey, J; Derkits, GE; Reents, WD; Garfias, LF (2007) The corrosion of electronic resistors. Ieee Transactions On Components And Packaging Technologies :666-672

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2007

Microstructural development of copper sulfide on copper exposed to humid H2S

Reid, M; Punch, J; Ryan, C; Garfias, LF; Belochapkine, S; Franey, JP; Derkits, GE; Reents, WD (2007) Microstructural development of copper sulfide on copper exposed to humid H2S. Journal Of The Electrochemical Society :C209-C214

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2006

Corrosion resistance of copper-coated contacts

Reid, M; Punch, J; Grace, G; Garfias, LF; Belochapkine, S (2006) Corrosion resistance of copper-coated contacts. Journal Of The Electrochemical Society :B513-B517

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2006

Piecewise analysis and modeling of circuit pack temperature cycling data

Joyce, T. and Lisay Jr, E.J. and Dalton, D.E. and Punch, J.M. and Shellmer, M.S. and Kher, S.N. and Goyal, S. (2006) Piecewise analysis and modeling of circuit pack temperature cycling data. Bell Labs Technical Journal :21-37

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2003

A board level study of an array of ball grid components

Cole, R; Davies, M; Punch, J (2003) A board level study of an array of ball grid components. Journal Of Electronic Packaging :480-489

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2001

Forced convection board level thermal design methodology for electronic systems

Cole, R; Dalton, T; Punch, J; Davie, MR; Grimes, R (2001) Forced convection board level thermal design methodology for electronic systems. Journal Of Electronic Packaging :120-126

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2001

Modeling electronic cooling axial fan flows

Grimes, R; Davies, M; Punch, J; Dalton, T; Cole, R (2001) Modeling electronic cooling axial fan flows. Journal Of Electronic Packaging :112-119

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2001

Forced Convection Board Level Thermal Design Methodology

Cole, R., Dalton, T., Punch, J., Davies, M., and Grimes, R. (2001) Forced Convection Board Level Thermal Design Methodology. J. Electronic Packaging :120-126

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1995

Electronics Cooling

Punch, J (1995) Electronics Cooling. The Irish Scientist :64-

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1993

Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.

Punch, J; Davies, MRD (1993) Three Dimensional Heat Conduction Through Rectangular Multiple Layer Plane Substrates.. American Society Of Mechanical Engineers :89-100

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Books

This author has not written any publications of this type yet.

Book Chapters

1997

Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards

Punch, J; Davies, MRD (1997) Still-air Junction-to-Ambient Thermal Resistances of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards. Thermal Management of Electronic Systems III :262-268

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1994

A Parametric Study of Heat Spreading Through Multiple Layer Substrates

PUNCH, J; DAVIES, M (1994) A Parametric Study of Heat Spreading Through Multiple Layer Substrates. Netherlands : Kluwer Thermal Management of Electronic Systems :159-168

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1994

The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count

Davies, MRD; Punch, J; Moore, T; Lohan, J (1994) The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count. Thermal Management of Electronics Systems :287-297

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1994

A Parametric Study of Heat Spreading Through Multiple Layer Substrates

Punch, J; Davies, MRD (1994) A Parametric Study of Heat Spreading Through Multiple Layer Substrates. Thermal Management of Electronic Systems :159-169

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Edited Books

This author has not written any publications of this type yet.

Other Journals

2006

Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques)

Punch, J (2006) Thermal Management of Electronic Systems: Emerging Technologies and Acoustic Challenges (Gestion Thermique des Systèmes Électroniques: Technologies Naissantes et Défis Acoustiques). Acoustique et Techniques :34-40

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Conference Publications

2011

ASME International Mechanical Engineering Congress and Exposition (IMECE)

Mac Giolla Eain M., Egan V., Punch J. (2011) ASME International Mechanical Engineering Congress and Exposition (IMECE) .

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2010

2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

Breen, TJ; Walsh, EJ; Punch, J; Shah, AJ; Bash, CE (2010) 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS.

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2010

2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

Walsh, EJ; Breen, TJ; Punch, J; Shah, AJ; Bash, CE (2010) 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS.

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2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Walsh E.J., Breen T.J., Punch J., Shah A.J., Bash C.E. (2010) 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010.

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2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Breen T.J., Walsh E.J., Punch J., Shah A.J., Bash C.E. (2010) 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010.

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2010

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Punch J., Walsh E., Grimes R., Jeffers N., Kearney D. (2010) 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010.

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2010

IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1

Herkommer, D; Punch, J; Reid, M (2010) IPACK 2009: PROCEEDINGS OF THE ASME INTER PACK CONFERENCE 2009, VOL 1. :737-742

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2010

IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5

Burke, C; Punch, J (2010) IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5. :121-129

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2010

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Burke C., Punch J. (2010) ASME International Mechanical Engineering Congress and Exposition, Proceedings. :121-129

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2009

HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2

Kearney, D; Punch, J; Grimes, R (2009) HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2. :755-764

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2009

HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1

Jeffers, N; Punch, J; Walsh, E (2009) HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 1. :865-875

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2009

IEEE Electronic Components and Technology Conference

Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I. (2009) IEEE Electronic Components and Technology Conference. :423-430

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2009

EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Herkommer, D; Reid, M; Punch, J (2009) EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS. :281-288

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2009

HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2

Jeffers, N; Punch, J; Walsh, E (2009) HT2008: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2008, VOL 2. :709-717

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2009

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Herkommer D., Reid M., Punch J. (2009) 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009.

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2009

2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008

Kearney D., Punch J., Grimes R. (2009) 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008. :755-764

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2008

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Herkommer D., Reid M., Punch J. (2008) EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

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2008

Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008

Sheehy M., Lishchynska M., Punch J., Goyal S., Kelly G. (2008) Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008. :355-362

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2008

2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3

Walsh, EJ; Walsh, PA; Grimes, R; Punch, J (2008) 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3. :464-470

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2008

Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008

Kelly G., Punch J., Goyal S., Sheehy M. (2008) Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008. :782-791

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2008

DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS

Sheehy, M; Reid, M; Punch, J; Goyal, S; Kelly, G (2008) DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. :2-7

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2008

EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3

Herkommer, D; Reid, M; Punch, J (2008) EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3. :506-515

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2008

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Punch J. (2008) EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

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2007

PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2

Kearney, D; Punch, J; Grimes, R (2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2. :893-900

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2007

Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007

Sheehy M., Kelly G., Rodgers B., Punch J., Goyal S. (2007) Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007. :1236-1243

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2007

Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007

Kelly G., Sheehy M., Rodgers B., Punch J., Goyal S. (2007) Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007. :943-952

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2007

PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3

Jeffers, N; Punch, J; Walsh, E (2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3. :267-274

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2007

ASME-JSME Thermal Engineering and Summer Heat Transfer Conference

Walsh, EJ; Walsh, P; Grimes, R; Punch, J; Egan, V (2007) ASME-JSME Thermal Engineering and Summer Heat Transfer Conference.

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2007

2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007

Razeeb K.M., Munari A., Dalton E., Punch J., Roy S. (2007) 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007. :817-823

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2007

PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3

Grimes, R; Quin, D; Walsh, E; Punch, J (2007) PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 3. :275-281

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2006

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Kelly G.A., Punch J.M., Goyal S. (2006) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP.

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2006

Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems

Sheehy M., Punch J., Rodgers B., Goyal S. (2006) Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Multi-Scale Electrical and Mechanical Systems.

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2006

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Punch J., Grimes R., Heaslip G., Galkin T., Vakevainen K., Kyyhkynen V., Elonen E. (2006) Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. :2303-2308

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2006

American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED

Kearney D., Punch J., Grimes R. (2006) American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED.

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2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Ryan, C; Punch, J; Rodgers, B (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :436-440

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2005

Advances in Electronic Packaging 2005, Pts A-C

Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E (2005) Advances in Electronic Packaging 2005, Pts A-C. :2303-2308

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2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Reid, M; Punch, J; Galkin, T; Vakevainen, K; Stenberg, T; Vilen, M; Pomeroy, MJ; Mihov, M (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :330-334

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2005

ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C

Heaslip, G; Punch, J; Rodgers, B; Ryan, C; Reid, M (2005) ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C. :1283-1291

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2005

2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL

Reid, M; Punch, J; Rodgers, B; Pomeroy, MJ; Galkin, T; Stenberg, T; Rusanen, O; Elonenc, E; Vilen, M; Vakevainen, K (2005) 2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL. :300-304

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2005

HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4

Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E (2005) HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 4. :871-876

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2005

Advances in Electronic Packaging 2005, Pts A-C

Reid, M; Punch, J; Rodgers, B; Galkin, T; Stenberg, T; Rusanenc, O; Elonen, E; Vilen, M; Vakevainen, K (2005) Advances in Electronic Packaging 2005, Pts A-C. :1271-1276

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2005

Advances in Electronic Packaging 2005, Pts A-C

Rodgers, B; Flood, B; Punch, J; Waldron, F (2005) Advances in Electronic Packaging 2005, Pts A-C. :1263-1270

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2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Punch, J; Grimes, R; Heaslip, G; Galkin, T; Vakevainen, K; Kyyhkynen, V; Elonen, E (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :398-405

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2005

Advances in Electronic Packaging 2005, Pts A-C

Ryan, C; Rodgers, BA; Punch, JM (2005) Advances in Electronic Packaging 2005, Pts A-C. :1223-1228

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2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Punch, J (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :688-694

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2005

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Heaslip, GM; Punch, JM; Rodgers, BA; Ryan, C; Reid, M (2005) THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS. :277-284

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2005

HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4

Hanly, K; Grimes, R; Walsh, E; Rodgers, B; Punch, J (2005) HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4. :549-+

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2005

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Rodgers, B; Flood, B; Punch, J; Waldron, F (2005) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. :490-496

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2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Heaslip G.M., Punch J.M., Rodgers B.A., Ryan C. (2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. :353-362

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2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Rodgers B., Ryan C., Punch J., Waldron F., Floyd L. (2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. :153-159

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2004

2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS

Griffin, P; Leahy, JJ; Punch, J; Galkin, T; Elonen, E; Rusanen, O (2004) 2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS. :242-250

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2004

ITHERM 2004, VOL 2

Ryan, C; ONeill, S; Donovan, J; Punch, J; Rodgers, B; Murphy, E (2004) ITHERM 2004, VOL 2. :664-668

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2004

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Punch J., Rodgers B., Newport D., Davies M. (2004) American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. American Society Of Mechanical Engineers, Heat Transfer Division, (Publication) Htd :661-668

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2004

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Ryan C., Rodgers B., Punch J.M., Heaslip G., Murphy E., O'Neill S. (2004) American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. :187-195

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2003

Proceedings of the Annual Reliability and Maintainability Symposium

Donovan J., Loll V., Punch J. (2003) Proceedings of the Annual Reliability and Maintainability Symposium. :528-533

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2003

ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003

Heaslip, GM; Punch, JM (2003) ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003. :125-133

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2002

ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS

Rodgers, B; Punch, J; Jarvis, J; Myllykoski, P; Reinikainen, T (2002) ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS. :993-1000

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2001

Proceedings of the National Heat Transfer Conference

Davies M., Cole R., Punch J. (2001) Proceedings of the National Heat Transfer Conference. :115-121

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2001

Proceedings of the National Heat Transfer Conference

Cole R., Davies M., Punch J. (2001) Proceedings of the National Heat Transfer Conference. :105-113

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1994

THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS

DAVIES, M; LOHAN, J; PUNCH, J; MOORE, T (1994) THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS. :287-296

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Conference Contributions

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Published Reports

This author has not written any publications of this type yet.

Editorials

2010

Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator

Jeffers, N; Punch, J; Walsh, E (2010) Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator. :177-178

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Book Reviews

This author has not written any publications of this type yet.

Other Publications

2011

Cooling Device

Walsh, EJ; Walsh, PA; Grimes, R; Punch, J; (2011) Cooling Device. International Patent Offices

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2010

A Cooling Device

Walsh, EJ; Walsh, PA; Grimes, R; Punch, J (2010) A Cooling Device. Ireland, US, China, World International Patent Offices

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2010

Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator

Jeffers, N; Punch, J; Walsh, E (2010) Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40 degrees Wall Jet Swirl Generator. :177-178

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2001

Thermal Roadmap of Portable Products

Dalton, TM; Newport, D; Punch, J; Grimes, R (2001) Thermal Roadmap of Portable Products.

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1998

Industrial seminars on the Thermal Management of Electronic Systems

Punch, J; Davies, MRD; Lohan, L; Dalton, T; Newport, D (1998) Industrial seminars on the Thermal Management of Electronic Systems.

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1996

Lecture Series on Thermal Management of Electronic Systems

Punch, J; Davies, MRD; Lohan, J (1996) Lecture Series on Thermal Management of Electronic Systems.

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1994

Lecture Series on Thermal Management of Electronic Systems

Punch, J; Davies, MRD; Dillon, P (1994) Lecture Series on Thermal Management of Electronic Systems.

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1994

The Thermal Behaviour of Multiple Layer Substrates

Punch, J (1994) The Thermal Behaviour of Multiple Layer Substrates. University of Limerick

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1992

The Computer Products Guide to the Thermal Management of Power Converters

Punch, J; Davies, MRD (1992) The Computer Products Guide to the Thermal Management of Power Converters.

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1991

Cool Power

Davies, MRD; Rodgers, P; Punch, J (1991) Cool Power.

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1991

Cooling Electronic Power Supplies

Davies, MRD; Rodgers, P; Punch, J (1991) Cooling Electronic Power Supplies.

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