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Publication

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Reid, M; Punch, J; Galkin, T; Vakevainen, K; Stenberg, T; Vilen, M; Pomeroy, MJ; Mihov, M
(2005)
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems