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The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count
Davies, MRD; Punch, J; Moore, T; Lohan, J
(1994)
The Thermal Characteristics of a Board-Mounted 160 Lead Quad Flat Pack: The Effect of Board Copper Content, Board Orientation and Lead Count in Thermal Management of Electronics Systems