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Home | Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R; Osenbach, J; Collins, MN; McCormick, H; Read, P; Fleming, D; Popowich, R; Punch, J; Reid, M; Kummerl, S
Ieee Transactions On Components Packaging And Manufacturing Technology (2011)
10.1109/TCPMT.2011.2140109