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A Phenomenological Study of the Effect of Microstructural Evolution on Pb-free Solder Joint Fatigue Resistance
Coyle, R; Reid, M; Osenbach, J; Ryan, C; Read, P; Fleming, D; Popowich, R; McCormick, H; Punch, J; Collins, M; Koshmeider, T; Manock, J; Kummerl, S; Chatterji, I
(2009)
A Phenomenological Study of the Effect of Microstructural Evolution on Pb-free Solder Joint Fatigue Resistance in Journal Of Electronic Materials